Hoʻokaʻawale ʻia nā huila daimana i ka ceramic, resin, metal sintering, electroplating, brazing, etc.

1. Resin paʻa wili huila: maikaʻi ponoʻī, ʻaʻole maʻalahi e ālai, maʻalahi, a me ka polishing maikaʻi, akā ʻo ke kupapaʻu paʻa he ikaika maikaʻi ʻole, paʻa maikaʻi ʻole o ke daimana ma ke kupapaʻu, ʻino ka wela a me ke kūpaʻa ʻana, no laila ʻaʻole ia. kūpono no ka huila wili ʻoʻoleʻa, ʻaʻole kūpono no ka wili kaumaha.

2. ʻAʻole ʻoi aku ka ʻoi o ka huila metala, ʻoi aku ka ʻoi o ka paʻa resin akā ʻilihune ka paʻa ʻana o ke ʻano ma muli o ka elasticity kiʻekiʻe.

3. Ceramic paa wili huila: kiʻekiʻe porosity, kiʻekiʻe rigidity, adjustable hale (hiki ke hana i ka nui pores), 'aʻole i hoʻopaʻa 'ia i ka metala;akā palupalu

Mea hoʻopili hui:

Resin-metal composite: resin base, hoʻolauna metala–hoʻohana i ka metala thermal conductivity e hoʻololi i ka hana wili o ka resin binder Metal-ceramic composite: kumu metala, hoʻokomo i nā seramika-ʻaʻole wale ka hopena o ka hopena o ka matrix metala, maikaʻi ka uila a me ka thermal conductivity, akā, ʻo ka palupalu nō hoʻi o ka keramika.

Ma muli o kona paʻakikī maikaʻi, kūpono loa ke daimana no ka hana ʻana i nā mea aʻe:

1. ʻO ka carbide sima a pau

2. Cermet

3. Oxide a me non-oxide seramika

4.PCD/PCBN

5. Alloy me ka paakiki kiʻekiʻe

6. Sapphire a me ke aniani

7. Ferrite

8. Kipi

9. Hoʻopili i ka fiber composite

10. Pōhaku

No ka mea, ua haku ʻia ke daimana i ke kalapona maʻemaʻe, ʻaʻole kūpono ia no ka hana ʻana i nā mea kila.ʻO ka wela kiʻekiʻe i ka wā e wili ai ka mea e hana ai ka hao a me ke daimana i loko o ke kila a hoʻopau i nā ʻāpana daimana.


Ka manawa hoʻouna: Jun-10-2020

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